For Precision Soldering with Fast and Reliable Results
🔧 Key Features:
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Lead & Silver Composition
Offers superior conductivity and strength for optimal solder joints. -
Medium-Temperature Welding (183℃)
Ideal for protecting temperature-sensitive components during soldering. -
No False Soldering
Provides consistent, reliable solder joints without cold soldering. -
Fast Soldering
Quickly solders components with minimal wait time, no cleaning required. -
Syringe Design
Convenient syringe packaging with needle and push rod for easy application. -
Oxidation Resistant
Ensures clean solder joints with resistance to oxidation. -
Bright, Full Solder Joints
Produces smooth, well-formed solder joints for a professional finish. -
Moderate Viscosity
Fine paste consistency that resists collapse and component shifting.
🎯 Applications:
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SMT Patches
Ideal for surface-mount technology (SMT) soldering. -
BGA Welding
Suitable for Ball Grid Array (BGA) soldering. -
LED Patches
Perfect for LED component soldering. -
Mobile Phone Repair
Excellent for mobile phone component soldering. -
Wire and Capacitor Soldering
Can be used for wire welding and soldering capacitors and resistors.
📏 Specifications:
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Model: [HW21S]
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Composition: Lead and Silver
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Operating Temperature: 183℃
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Viscosity: Moderate
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Cleaning: No cleaning required
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Packaging: Syringe design with needle and push rod
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Applications: SMT, BGA, LED, mobile phone repair, wire welding
This high-quality solder paste is ideal for professionals who need reliable, fast, and precise soldering results.