[HW4] RELIFE High-Precision Chip repair tinning set

HW4 High-Precision Chip Reballing Kit

3-Temperature Solder Paste + Premium Scraper + Desoldering Wire
Perfect for smartphone CPU and chip-level repairs

🔧 Product Highlights

• 3 Temperature Solder Paste Options

  • 138°C – Low temp, ideal for heat-sensitive chips

  • 183°C – Medium temp, suitable for most general repairs

  • 227°C – High temp, designed for fast solder penetration
    Tailored to meet a wide range of chip reballing needs with precision and consistency.

• High-Quality Steel Reballing Scraper
  Crafted from premium-grade steel with excellent resilience and anti-deformation properties. The ergonomic blade design supports various angles for effective tin scraping and reballing operations.

• Scientifically Formulated Desoldering Wire
  Efficient, clean absorption with low residue. Oxidation and corrosion resistant, ensuring better heat transfer and tidy chip rework.

🧰 All-in-One Solution for Chip Repair

Whether you're fixing solder collapse, solder bridging, or leftover residue, this comprehensive kit simplifies the reballing process — reducing rework rates and boosting efficiency. It’s a go-to toolkit for mobile phone logic board technicians and chip-level repair specialists.

📦 What’s Included:

• 1× Reballing & scraping tool (premium steel)

• 1× Low-temperature solder paste (138°C)

• 1× Medium-temperature solder paste (183°C)

• 1× High-temperature solder paste (227°C)

• 1× Desoldering wire

📐 Product Details

Note: Manual measurements may vary slightly. Please refer to the actual product.

💡 Why Choose HW4?

• One-stop solution for all chip soldering needs

• Reduces failure and rework rates

• Designed for both professional and advanced DIY users

• Suitable for smartphones, tablets, and other precision electronics