Reflow Soldering Heating Platform
Features:
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Versatile Reflow Soldering Modes:
- Offers 5 professional modes for specific tasks like degumming, layering, lamination, tin planting, and welding.
- Includes 3 common operation modes with memory functionality for quick and easy use.
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Curve Heating for Mobile Motherboards:
Designed especially for original mobile phone motherboard soldering with precise curve heating for safe desoldering and reflow operations. -
Advanced Heating Technology:
- Upgraded MCH ceramic double heating element replaces traditional single elements.
- Delivers faster heating, uniform temperature distribution, and enhanced performance stability.
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Temperature Memory:
- 3 commonly used memory temperatures can be recorded manually or automatically, even retaining settings when powered off.
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Efficient Heat Dissipation:
- Equipped with turbofan blades and a strong wind cooling system.
- Automatically adjusts fan speed based on the temperature for optimal heat management.
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Real-Time Monitoring:
- Tracks temperature changes and displays reflow soldering temperature curve data.
- Real-time detection of both heating and cooling temperatures without switching interfaces.
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Broad Compatibility:
Suitable for a wide range of iPhone models, including:- iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12 Mini, 12, 12 Pro, 12 Pro Max, 13 Mini, 13, 13 Pro, 13 Pro Max.
Specifications:
- Package Weight: 1.22 kg / 2.69 lb
- Package Dimensions: 20 cm x 18 cm x 8 cm (7.87 in x 7.09 in x 3.15 in)
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Carton Details:
- 16 units per carton.
- Carton Weight: 20.40 kg / 44.97 lb.
- Carton Dimensions: 42 cm x 38 cm x 34 cm (16.54 in x 14.96 in x 13.39 in).
